P/N 825502B03453
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825502B03453 (pdf) |
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Board Level Heat Sinks P/N 825502B03453 TO-220 Temp Rise Above Ambient - oC Mounting Surface Thermal Resistance - oC / Watt Mounting Surface to Ambient PRODUCT SPECIFICATIONS • Devices TO-220 • Size x mm • Material Aluminum, mm • Type Stamped • IC Mounting Integrated Spring • PCB Mounting Solderable Tabs • Finish Black Anodized • Package Bulk • Optional Hardware Thermal Interface Material • Includes Spring Clip for Quick Device Attachment • Curled Flow Fins • Vertical Mounting via Solderable Tabs • RoHS Compliant CUSTOMIZED HEATSINKS • Specialized Tabs, Plating • Specialized Body Configurations • Contact Applications Engineering 0 100 60 40 Air Velocity - LFM Heat Dissipated - Watts 1000 10 COMAIR ROTRON, INC 8929 Terman Court, San Diego, CA 92121 Ph 858 348-6200 Fax 858 566-4577 E-mail Web: |
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