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821002B00000 (pdf) |
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Board Level Heat Sinks P/N: TO-220 Temp Rise Above Ambient -oC Mounting Surface Thermal Resistance - oC / Watt Mounting Surface to Ambient PRODUCT SPECIFICATIONS • Devices TO-220 • Size x mm • Material Aluminum, mm Thick • Type Stamped • Weight grams • PCB Mounting Solderable Device Leads • Finish Black Anodized • Package Bulk • Accessories Hardware & Thermal Interface Material • Hole for Device Attachment • RoHS Compliant CUSTOMIZED HEATSINKS • Specialized Plating • Specialized Body Configurations • Contact Applications Engineering 0 100 80 60 40 20 Air Velocity - LFM Heat Dissipated - Watts COMAIR ROTRON, INC 8929 Terman Court, San Diego, CA 92121 Ph 858 348-6200 Fax 858 566-4577 E-mail Web: 1000 20 16 12 8 4 0 5 |
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