Part | Datasheet |
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811102B00000 (pdf) |
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Board Level Heat Sinks P/N: TO-220 Temp Rise Above Ambient - oC Mounting Surface Thermal Resistance - oC / Watt Mounting Surface to Ambient PRODUCT SPECIFICATIONS • Devices TO-220 • Size x mm • Material Aluminum, mm Thick • Weight grams • Type Stamped • PCB Mounting Solderable Tabs • Finish Black Anodized • Package Bulk • Accessories Hardware & Thermal Interface Material • Hole for Device Attachment • Staggered Fins for Improved Performance • Vertical Mounting via Solderable Tabs • RoHS Compliant CUSTOMIZED HEATSINKS • Specialized Tabs, Plating • Specialized Body Configurations • Contact Applications Engineering 0 100 60 40 Air Velocity - LFM Heat Dissipated - Watts COMAIR ROTRON, INC 8929 Terman Court, San Diego, CA 92121 Ph 858 348-6200 Fax 858 566-4577 E-mail Web: 1000 20 |
More datasheets: BRN6044-0006S | BRN6044-0007S | BRN6044-0008S | BRN6044-0009S | BRN6044-0010S | BRN6044-0012S | BRN6044-0013S | BRN6044-0014S | BRN6044-0015S | 15-21UBC/C430/TR8 |
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