412310B02500
412310B02500 Datasheet
P/N 412310B02500
| Part | Datasheet |
|---|---|
412310B02500 |
412310B02500 (pdf) |
| PDF Datasheet Preview |
|---|
| Board Level Heat Sinks P/N 412310B02500 TO-218 & TO-220 Temp Rise Above Ambient - oC Mounting Surface Thermal Resistance - oC/ Watt Mounting Surface to Ambient PRODUCT SPECIFICATIONS • Devices TO-218 & TO-220 • Size x mm • Material Aluminum • Type Extruded • PCB Mounting Solderable Pins • Finish Black Anodized • Package Bulk • Accessories Hardware & Thermal Interface Material • Tapped Hole for Device Attachment • Vertical Mounting via Solderable Pins • RoHS Compliant CUSTOMIZED HEATSINKS • Specialized Plating • Specialized Body Configurations • Contact Applications Engineering 0 100 Air Velocity - LFM Heat Dissipated - Watts 1000 10 COMAIR ROTRON, INC 8929 Terman Court, San Diego, CA 92121 Ph 858 348-6200 Fax 858 566-4577 E-mail Web: |
| More datasheets: AT93C57-10SC-2.5 | AT93C57W-10SI-2.5 | AT93C57W-10SI-1.8 | AT93C57W-10SI | AT93C57-10PI | AT93C57W-10SC-2.7 | AT93C57W-10SC-2.5 | AT93C57-10SI-2.7 | AT93C57W-10SC | ADL5504ACBZ-P2 |
Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived 412310B02500 Datasheet file may be downloaded here without warranties.