P/N 411910B02500
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411910B02500 (pdf) |
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Board Level Heat Sinks P/N 411910B02500 TO-202 & TO-220 Temp Rise Above Ambient - oC Mounting Surface Thermal Resistance - oC/ Watt Mounting Surface to Ambient PRODUCT SPECIFICATIONS • Devices TO-202 & TO-220 • Size x mm • Material Aluminum • Weight g • Type Extruded • Finish Black Anodized • PCB Mounting Solderable Pins • Package Bulk • Accessories Hardware & Thermal Interface Material • Multiple Holes for Device Attachment • Dual Device Cooling Heat Sink • Vertical Mounting via Solderable Pins • RoHS Compliant CUSTOMIZED HEATSINKS • Specialized Plating • Specialized Body Configurations • Contact Applications Engineering 0 100 Air Velocity - LFM Heat Dissipated - Watts COMAIR ROTRON, INC 8929 Terman Court, San Diego, CA 92121 Ph 858 348-6200 Fax 858 566-4577 E-mail Web: 1000 10 |
More datasheets: DPCI-204-1203MG | DPCI-204-1203G | CPCI-204L-1203G | CPCI-154-1203G | CPCI-354T-1203G | CPCI-204-1203MG | CPCI-204-1203G | CPCI-354-1203G | FIN1032M | FIN1032MTC |
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