411616B02500
411616B02500 Datasheet
P/N 411616B02500
| Part | Datasheet |
|---|---|
411616B02500 |
411616B02500 (pdf) |
| PDF Datasheet Preview |
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| Board Level Heat Sinks P/N 411616B02500 TO-218, TO-220 & TO-247 Temp Rise Above Ambient - oC Mounting Surface Thermal Resistance - oC/ Watt Mounting Surface to Ambient PRODUCT SPECIFICATIONS • Devices TO-218, TO-220 & TO-247 • Size x 38.1MM • Material Aluminum • Type Extruded • Finish Black Anodized • PCB Mounting Solderable Pins • Package Bulk • Accessories Hardware & Thermal Interface Material • Hole for Device Attachment • Dual Device Cooling Heat Sink • Vertical Mounting via Solderable Pins • RoHS Compliant CUSTOMIZED HEATSINKS • Specialized Plating • Specialized Body Configurations • Contact Applications Engineering 0 100 60 40 Air Velocity - LFM Heat Dissipated - Watts 1000 5 COMAIR ROTRON, INC 8929 Terman Court, San Diego, CA 92121 Ph 858 348-6200 Fax 858 566-4577 E-mail Web: |
| More datasheets: PW182RA4800F01 | UTC-300P-BB41E | UTC-300P-BW41E | UTC-300P-BB31E | UTC-300P-BW31E | UTC-300P-BB30E | UTC-300P-BB40E | UTC-300P-BW40E | UTC-300P-BW30E | HMC-T2240 |
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