WS1102-BLK

WS1102-BLK Datasheet

WS1102 3 x 3 Power Amplifier Module for CDMA/AMPS MHz

Part	Datasheet
WS1102-BLK	WS1102-BLK (pdf)

Related Parts	Information
WS1102-TR1	WS1102-TR1

PDF Datasheet Preview
WS1102 3 x 3 Power Amplifier Module for CDMA/AMPS MHz Data Sheet The WS1102 is a CDMA Code Division Multiple and AMPS Advanced Mobile Phone Service power amplifier module designed for handsets operating in the MHz bandwidth. The WS1102 features CoolPAM circuit technology that offers state-of-the-art reliability, temperature stability and ruggedness. The WS1102 meets stringent CDMA linearity requirements to and beyond 28 dBm output power. The 3 mm x 3 mm form factor 8-pin surface mount package is self contained, incorporating 50 ohm input and output matching networks. • Good linearity • Excellent efficiency 40% at Pout = 28 dBm; 19% at Pout = 16 dBm without a DC/DC converter • 8-pin surface mounting package 3 mm x 3 mm x mm • Internal 50Ω matching networks for both RF Input and output • CDMA 95A/B, CDMA2000-1X/EVDO • Digital Cellular CDMA • Analog Cellular AMPS Functional Block Diagram Vcc1 1 Vcc2 8 RF Input 2 Input Match Inter Stage Match Bias Circuit & Control Logic MMIC Vcont 3 Vref 4 Output Match RF Output 7 MODULE Table Absolute Maximum Ratings[1] Parameter RF Input Power DC Supply Voltage DC Reference Voltage Storage Temperature Symbol Min. Nominal Max. Unit Vref Tstg +125 Table Recommended Operating Conditions Parameter DC Supply Voltage DC Reference Voltage Mode Control Voltage High Power Mode Low Power Mode Operating Frequency Ambient Temperature Symbol Min. Nominal Max. Unit Vref Vcont Vcont -30 25 Table Power Range Truth Table Ordering Information Part Number WS1102-BLK WS1102-TR1 Number of Devices 100 2500 Container Bulk 13" Tape and Reel Tape and Reel Information Dimension List Annote A0 B0 K0 D0 D1 P0 P1 Milimeter ± ± ± ± ± ± ± Annote P2 P10 E F W T Figure Tape and Reel Format 3mm x 3mm. Milimeter ± ± ± ± ± ± Tape and Reel Information, continued all dimensions are in millimeters Figure Plastic Reel Format Handling and Storage ESD Electrostatic Discharge Electrostatic discharge occurs naturally in the environment. With the increase in voltage potential, the outlet of neutralization or discharge will be sought. If the acquired discharge route is through a semiconductor device, destructive damage will result. ESD countermeasure methods should be developed and used to control potential ESD damage during handling in a factory environment at each manufacturing site. The out of bag exposure time maximum limits are determined by the classification test described above which corresponds to a MSL classification level 6 to 1 according to the JEDEC standard IPC/JEDEC and J-STD-033. WS1102 is MSL3. Thus, according to the J-STD-033 p.11 the maximum Manufacturers Exposure Time MET for this part is 168 hours. After this time period, the part would need to be from the reel, de-taped and then re-baked. MSL Moisture Sensitivity Level Plastic encapsulated surface mount package is to damage induced by absorbed moisture and temperature. Avago Technologies JEDEC Standard J-STD 020B. Each component and package type is classified for moisture sensitivity by soaking a known dry package at various temperatures and relative humidity, and times. After soak, the components are subjected to three consecutive simulated reflows. MSL classification reflow temperature for the WS1102 is targeted at 250°C +0/-5°C. Figure 19 and Table 7 show typical SMT profile for maximum temperature of 250°C +0/-5°C. Table ESD Classification Pin# Name Vcc1 Supply Voltage ± 2000V RF In RF Input ± 2000V Vcont Control Voltage ± 2000V Vref Reference Voltage ± 2000V Ground ± 2000V Ground ± 2000V RF Out RF Output ± 2000V

PDF Datasheet Preview

WS1102 3 x 3 Power Amplifier Module for CDMA/AMPS MHz

Data Sheet

The WS1102 is a CDMA Code Division Multiple and AMPS Advanced Mobile Phone Service power amplifier module designed for handsets operating in the MHz bandwidth. The WS1102 features CoolPAM circuit technology that offers state-of-the-art reliability, temperature stability and ruggedness.

The WS1102 meets stringent CDMA linearity requirements to and beyond 28 dBm output power. The 3 mm x 3 mm form factor 8-pin surface mount package is self contained, incorporating 50 ohm input and output matching networks.
• Good linearity
• Excellent efficiency 40% at Pout = 28 dBm;
19% at Pout = 16 dBm without a DC/DC converter
• 8-pin surface mounting package
3 mm x 3 mm x mm
• Internal 50Ω matching networks for both RF Input
and output
• CDMA 95A/B, CDMA2000-1X/EVDO
• Digital Cellular CDMA
• Analog Cellular AMPS

Functional Block Diagram

Vcc1 1

Vcc2 8

RF Input 2

Input Match

Inter

Stage

Match

Bias Circuit & Control Logic MMIC

Vcont 3

Vref 4

Output Match

RF Output 7

MODULE

Table Absolute Maximum Ratings[1]

Parameter

RF Input Power DC Supply Voltage DC Reference Voltage Storage Temperature

Symbol Min. Nominal Max.

Unit

Vref

Tstg
+125

Table Recommended Operating Conditions

Parameter

DC Supply Voltage DC Reference Voltage Mode Control Voltage High Power Mode Low Power Mode Operating Frequency Ambient Temperature

Symbol Min. Nominal Max.

Unit

Vref

Vcont

Vcont
-30 25

Table Power Range Truth Table
Ordering Information

Part Number WS1102-BLK WS1102-TR1

Number of Devices 100 2500

Container Bulk 13" Tape and Reel

Tape and Reel Information

Dimension List Annote A0 B0 K0 D0 D1 P0 P1

Milimeter ± ± ± ± ± ± ±

Annote P2 P10 E F W T

Figure Tape and Reel Format 3mm x 3mm.

Milimeter ± ± ± ± ± ±

Tape and Reel Information, continued
all dimensions are in millimeters Figure Plastic Reel Format

Handling and Storage

ESD Electrostatic Discharge Electrostatic discharge occurs naturally in the environment. With the increase in voltage potential, the outlet of neutralization or discharge will be sought. If the acquired discharge route is through a semiconductor device, destructive damage will result.

ESD countermeasure methods should be developed and used to control potential ESD damage during handling in a factory environment at each manufacturing site.

The out of bag exposure time maximum limits are determined by the classification test described above which corresponds to a MSL classification level 6 to 1 according to the JEDEC standard IPC/JEDEC and J-STD-033.

WS1102 is MSL3. Thus, according to the J-STD-033 p.11 the maximum Manufacturers Exposure Time MET for this part is 168 hours. After this time period, the part would need to be from the reel, de-taped and then re-baked.

MSL Moisture Sensitivity Level Plastic encapsulated surface mount package is to damage induced by absorbed moisture and temperature. Avago Technologies JEDEC Standard J-STD 020B. Each component and package type is classified for moisture sensitivity by soaking a known dry package at various temperatures and relative humidity, and times. After soak, the components are subjected to three consecutive simulated reflows.

MSL classification reflow temperature for the WS1102 is targeted at 250°C +0/-5°C. Figure 19 and Table 7 show typical SMT profile for maximum temperature of 250°C +0/-5°C.

Table ESD Classification

Pin#

Name

Vcc1

Supply Voltage
± 2000V

RF In

RF Input
± 2000V

Vcont

Control Voltage
± 2000V

Vref

Reference Voltage
± 2000V

Ground
± 2000V

Ground
± 2000V

RF Out

RF Output
± 2000V

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Datasheet ID: WS1102-BLK 520536