HSMW-CL25
HSMW-CL25 Datasheet
HSMW-CL25 0.25mm White Leadframe-Based Surface Mount ChipLED
| Part | Datasheet |
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HSMW-CL25 |
HSMW-CL25 (pdf) |
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| HSMW-CL25 0.25mm White Leadframe-Based Surface Mount ChipLED Data Sheet The HSMW-CL25 series of parts is designed with an ultra small form factor to allow this miniaturization. The HSMWCL25 series is the thinnest available top emitting package in the market with high brightness InGaN die technology. The leadframe construction of this package allows the part to transfer heat from the package, thus it is able to survive temperature conditions of -40°C to 85°C despite its small size. The target applications are Keypad backlighting, Push button backlighting and Status indicators. The target markets are Mobile Handsets, Communications, Office Automation, Industrial and Commercial automations, Home Market appliances, Networking, Medical Instruments, and Mobile Computing. This product is competitively priced, and production is geared towards short lead times and ample capacity. • Small size top firing • Small L x W x H mm package • Diffused optics • Compatible with IR Reflow • High brightness using InGaN die technology • Available in 8mm Tape on 7” 178 mm Diameter Reels Advantages • High package thermal dissipation capability due to the superior package leadframe design • Small footprint to overcome space count • Low thickness to overcome space constrains • Short lead times and competitive pricing CAUTION HSMW-CL25 LEDs are Class 1B ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Package Dimensions Notes All dimensions in millimeters inches . Tolerance is ±0.1mm in. unless otherwise specified Device Selection Guide Package Dimension mm L x W x H Die Technology Colors InGaN White Testing Current mA Parts per Reel 4000 Package Description Untinted, Diffused Absolute Maximum Ratings at TA = 25°C Parameter HSMW-CL25 Units DC Forward Current[1] Power Dissipation LED Junction Temperature Operating Temperature Range -40 to +85 Storage Temperature Range -40 to +85 Soldering Temperature See reflow soldering profile Figure 7 & 8 Notes Derate linearly as shown in Figure Electrical Characteristics at TA = 25°C HSMW-CL25 Notes Vf tolerance ±0.1V Forward Voltage VF Volts [1] IF =5mA Typ. Max. |
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