HSMR-CL25 0.25mm Blue Leadframe-Based Surface Mount ChipLED
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HSMR-CL25 (pdf) |
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HSMR-CL25 0.25mm Blue Leadframe-Based Surface Mount ChipLED Data Sheet The HSMR-CL25 series of parts is designed with an ultra small form factor to allow this miniaturization. The HSMRCL25 series is the thinnest available top emitting package in the market with high brightness InGaN die technology. The leadframe construction of this package allows the part to transfer heat from the package, thus it is able to survive temperature conditions of -40°C to 85°C despite its small size. The target applications are Keypad backlighting, Push button backlighting and Status indicators. The target markets are Mobile Handsets, Communications, Office Automation, Industrial and Commercial automations, Home Market appliances, Networking, Medical Instruments, and Mobile Computing. This product is competitively priced, and production is geared towards short lead times and ample capacity. • Small size top firing • Small L x W x H mm package • Compatible with IR Reflow • High brightness using InGaN die technology • Available in 8mm Tape on 7” 178 mm Diameter Reels Advantages • High package thermal dissipation capability due to the superior package leadframe design • Small footprint to overcome space count • Low thickness to overcome space constrains • Short lead times and competitive pricing Package Dimensions LED DIE TOP VIEW RESIN LEADFRAME SIDE VIEW CATHODE SIDE TERMINAL VIEW Notes All dimensions are in millimeters. Tolerance is ±0.1mm unless otherwise specified. CAUTION HSMR-CL25 LEDs are Class 1B ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Device Selection Guide Package Dimension mm L x W x H Die Technology InGaN Colors Blue Testing Current mA Parts per Reel Package Description 4000 Untinted, Diffused Absolute Maximum Ratings at TA = 25°C Notes Derate linearly as shown in Figure HSMR-CL25 Units -40 to +85 -40 to +85 See reflow soldering profile Refer to Figures 7 & 8 Electrical Characteristics at TA = 25°C HSMR-CL25 Notes Vf tolerance ±0.1V Forward Voltage VF Volts [1] IF =5mA Typ. Max. Min. Thermal Resistance RqJ-PIN °C/W Typ. Optical Characteristics at TA = 25°C |
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