HSMF-C168

HSMF-C168 Datasheet


HSMF-C16x

Part Datasheet
HSMF-C168 HSMF-C168 HSMF-C168 (pdf)
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HSMF-C16x

Miniature Bi-Color Surface Mount ChipLEDs

Data Sheet

This series of bi-color ChipLEDs is designed with the smallest footprint to achieve high density of components on board. They have the industry standard footprint of mm x mm and a height of only mm. This makes them very suitable for cellular phone and mobile equipment backlighting and indication. They are available in a wide range of color combinations. In order to facilitate automated pick and place operation, these ChipLEDs are shipped in tape and reel, with 4000 units per reel. These parts are compatible with soldering.
• Small size
• 0603 industry standard footprint
• optics
• Operating temperature range of C to +85° C
• Compatible with soldering
• Available in various color combination
• Available in 8 mm tape on 7" 178 mm diameter
reels
• Keypad backlighting
• Symbol indicator
• LCD backlighting
• Pushbutton backlighting
• Front panel indicator

Device Selection Guide

Part Number HSMF-C162 HSMF-C163 HSMF-C164 HSMF-C165 HSMF-C166 HSMF-C167 HSMF-C168 HSMF-C169

Color AlInGaP Red / AlInGaP Amber AlInGaP Red / InGaN Green AlInGaP Red / InGaN Blue High Red / GaP Green GaP Yellow / GaP Green GaP Orange / GaP Green InGaN Green / InGaN Blue AlInGaP Amber / InGaN Blue

Package Description Untinted, Untinted, Untinted, Untinted, Untinted, Untinted, Untinted, Untinted,

CAUTION HSMF-C16x LEDs are class 1A ESD sensitive per JESD22-A114C.01 standard. Please observe appropriate precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details.

Package Dimensions

LED DIES 1 2

CATHODE LINE

DIFFUSED EPOXY PC BOARD

CATHODE LINE

SOLDERING TERMINALS

POLARITY

HSMF-C162 HSMF-C163 HSMF-C164 HSMF-C165 HSMF-C166 HSMF-C167 HSMF-C168 HSMF-C169

AMBER

GREEN

BLUE

GREEN

GREEN

GREEN

BLUE

BLUE

YELLOW ORANGE

GREEN

AMBER

NOTES ALL DIMENSIONS IN MILLIMETERS TOLERANCE IS ± MM UNLESS OTHERWISE SPECIFIED.

Absolute Maximum Ratings for Each Die at TA = 25° C

Parameter

AlInGaP

InGaN

DC Forward Current [1]

Power Dissipation

LED Junction Temperature

Operating Temperature Range
to +85
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Datasheet ID: HSMF-C168 520408