HLMP-Y801-JPP00
HLMP-Y801-JPP00 Datasheet
HLMP Y601/ Y651/Y701/Y801/ Y802/Y901/Y951 T-1 3mm AlInGaP LED Lamps
| Part | Datasheet |
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HLMP-Y801-JPP00 |
HLMP-Y801-JPP00 (pdf) |
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| HLMP Y601/ Y651/Y701/Y801/ Y802/Y901/Y951 T-1 3mm AlInGaP LED Lamps Data Sheet Failure Rate Prediction The junction temperature of the device determines the failure rate of semiconductor devices. The relationship between ambient temperature and actual junction temperature is given by the following: TJ °C = TA °C + where TA = ambient temperature in °C = thermal resistance of junction-to-ambient in °C/Watt PAVG = average power dissipated in Watt The estimated MTBF and failure rate at temperatures lower than the actual stress temperature can be determined by using an Arrhenius model for temperature acceleration. Results of such calculations are shown in the table below using activation energy of 0.43V. Table Life Tests Demonstrated Performance Colors Total Stress Test Conditions Device Hrs Green/Yellow/Amber/Red/ TA = +75°C DeepRed/Red Orange If = 20mA 84,000 Units Tested Units Failed Performance in Time 60% confidence MTBF[1] Failure Rate %/1K Hours 91700 Table Reliability Predictions Demonstrated Performance Ambient Temperature °C Junction Temperature[3] Performance in Time 60% Confidence MTBF [1] Failure Rate [2] %/1K Hours Performance in Time 90% Confidence Failure Rate MTBF %/1K Hours 86100 34300 88800 35400 91700 36500 109100 43400 |
| More datasheets: 1150 | 410-352 | LPX110-C | LPX110-B | 333-2UYC/H3/S400-A7 | TCS1 | 1308 | MV9101 | SP1486EMN-L/TR | SP1486EMN-L |
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