HFBR-5961GZ

HFBR-5961GZ Datasheet

HFBR-5961LZ/ALZ/GZ/AGZ Multimode Small Form Factor SFF Transceivers for ATM, FDDI, Fast Ethernet and SONET OC-3/SDH STM-1 with LC connector

Part	Datasheet
HFBR-5961GZ	HFBR-5961GZ (pdf)

Related Parts	Information
HFBR-5961ALZ	HFBR-5961ALZ
HFBR-5961LZ	HFBR-5961LZ
HFBR-5961AGZ	HFBR-5961AGZ

PDF Datasheet Preview
HFBR-5961LZ/ALZ/GZ/AGZ Multimode Small Form Factor SFF Transceivers for ATM, FDDI, Fast Ethernet and SONET OC-3/SDH STM-1 with LC connector Data Sheet The HFBR-5961xxZ transceiver from Avago provides the system designer with a product to implement a range of solutions for multimode fiber Fast Ethernet and SONET OC-3 SDH STM-1 physical layers for ATM and other services. This transceiver is supplied in the industry standard 2 x 5 DIP style with an LC fiber connector interface with an external connector shield. Transmitter Section The transmitter section of the HFBR-5961xxZ utilizes a 1300 nm InGaAsP LED. This LED is packaged in the optical subassembly portion of the transmitter section. It is driven by a custom silicon IC which converts differential PECL logic signals, ECL referenced shifted to a V supply, into an analog LED drive current. Receiver Section The receiver section of the HFBR-5961xxZ utilizes an InGaAs PIN photodiode coupled to a custom silicon transimpedance preamplifier IC. It is packaged in the optical subassembly portion of the receiver. This PIN/preamplifier combination is coupled to a custom quantizer IC which provides the final pulse shaping for the logic output and the Signal Detect function. The Data output is differential. The Signal Detect output is single ended. Both Data and Signal Detect outputs are PECL compatible, ECL referenced shifted to a V power supply. The receiver outputs, Data Output and Data Out Bar, are squelched at Signal Detect deassert. That is, when the light input power decreases to a typical -38 dBm or less, the Signal Detect deasserts, ie. the Signal Detect output goes to a PECL low state. This forces the receiver outputs, Data Out and Data Out Bar to go steady PECL levels high and low respectively. • Multisourced 2 x 5 package style • Operates with µm and 50/125 µm multimode fiber • Single V power supply • Wave solder and aqueous wash process compatibil- • Manufactured in an ISO 9001 certified facility • Full compliance with ATM Forum • UNI SONET OC-3 multimode fiber physical layer speci- fication • Full compliance with the optical performance require- ments of the FDDI PMD standard • Full compliance with the optical performance require- ments of 100Base-FX version of IEEE802.3u • RoHS compliant • PECL Signal Detect Output • Temperature range: HFBR-5961LZ 0 °C to +70 °C HFBR-5961ALZ -40 °C to +85 °C HFBR-5961GZ 0 °C to +70°C No EMI shield HFBR-5961AGZ -40 °C to +85°C No EMI shield • SONET/SDH equipment interconnect, OC-3/SDH STM-1 rate • Fast Ethernet • Multimode fiber ATM backbone links Package The overall package concept for the Avago transceiver consists of three basic elements the two optical subassemblies, an electrical subassembly, and the housing as illustrated in the block diagram in Figure The package outline drawing and pin out are shown in Figures 2 and The details of this package outline and pin out are compliant with the multisource definition of the 2 x 5 DIP. The low profile of the Avago transceiver design complies with the maximum height allowed for the LC connector over the entire length of the package. The optical subassemblies utilize a high-volume assembly process together with low-cost lens elements which result in a cost effective building block. The electrical subassembly consists of a high volume multilayer printed circuit board on which the ICs and various surface mounted passive circuit elements are attached. The receiver section includes an internal shield for the electrical and optical subassemblies to ensure high immunity to external EMI fields. The outer housing including the LC ports is molded of filled nonconductive plastic to provide mechanical strength. The solder posts of the Avago design are isolated from the internal circuit of the transceiver. The transceiver is attached to a printed circuit board with the ten signal pins and the two solder posts which exit the bottom of the housing. The two solder posts provide the primary mechanical strength to withstand the loads imposed on the transceiver by mating with the LC connector fiber cables. Ordering Information 1300 nm LED Operating Case Temperature 0 to +70 °C HFBR-5961LZ/HFBR-5961GZ 1300 nm LED Operating Case Temperature -40 to +85 °C HFBR-5961ALZ/HFBR-5961AGZ For product information and a complete list of distributors, please go to our web site Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright 2005-2009 Avago Technologies. All rights reserved. AV02-0820EN - April 24, 2009

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HFBR-5961LZ/ALZ/GZ/AGZ Multimode Small Form Factor SFF Transceivers for ATM, FDDI, Fast Ethernet and SONET OC-3/SDH STM-1 with LC connector

Data Sheet

The HFBR-5961xxZ transceiver from Avago provides the system designer with a product to implement a range of solutions for multimode fiber Fast Ethernet and SONET OC-3 SDH STM-1 physical layers for ATM and other services.

This transceiver is supplied in the industry standard 2 x 5 DIP style with an LC fiber connector interface with an external connector shield.

Transmitter Section

The transmitter section of the HFBR-5961xxZ utilizes a 1300 nm InGaAsP LED. This LED is packaged in the optical subassembly portion of the transmitter section. It is driven by a custom silicon IC which converts differential PECL logic signals, ECL referenced shifted to a V supply, into an analog LED drive current.

Receiver Section

The receiver section of the HFBR-5961xxZ utilizes an InGaAs PIN photodiode coupled to a custom silicon transimpedance preamplifier IC. It is packaged in the optical subassembly portion of the receiver.

This PIN/preamplifier combination is coupled to a custom quantizer IC which provides the final pulse shaping for the logic output and the Signal Detect function. The Data output is differential. The Signal Detect output is single ended. Both Data and Signal Detect outputs are PECL compatible, ECL referenced shifted to a V power supply. The receiver outputs, Data Output and Data Out Bar, are squelched at Signal Detect deassert. That is, when the light input power decreases to a typical -38 dBm or less, the Signal Detect deasserts, ie. the Signal Detect output goes to a PECL low state. This forces the receiver outputs, Data Out and Data Out Bar to go steady PECL levels high and low respectively.
• Multisourced 2 x 5 package style
• Operates with µm and 50/125 µm multimode
fiber
• Single V power supply
• Wave solder and aqueous wash process compatibil-
• Manufactured in an ISO 9001 certified facility
• Full compliance with ATM Forum
• UNI SONET OC-3 multimode fiber physical layer speci-
fication
• Full compliance with the optical performance require-
ments of the FDDI PMD standard
• Full compliance with the optical performance require-
ments of 100Base-FX version of IEEE802.3u
• RoHS compliant
• PECL Signal Detect Output
• Temperature range:

HFBR-5961LZ
0 °C to +70 °C

HFBR-5961ALZ -40 °C to +85 °C

HFBR-5961GZ
0 °C to +70°C No EMI shield

HFBR-5961AGZ -40 °C to +85°C No EMI shield
• SONET/SDH equipment interconnect, OC-3/SDH STM-1 rate
• Fast Ethernet
• Multimode fiber ATM backbone links

Package

The overall package concept for the Avago transceiver consists of three basic elements the two optical subassemblies, an electrical subassembly, and the housing as illustrated in the block diagram in Figure

The package outline drawing and pin out are shown in Figures 2 and The details of this package outline and pin out are compliant with the multisource definition of the 2 x 5 DIP. The low profile of the Avago transceiver design complies with the maximum height allowed for the LC connector over the entire length of the package.

The optical subassemblies utilize a high-volume assembly process together with low-cost lens elements which result in a cost effective building block.

The electrical subassembly consists of a high volume multilayer printed circuit board on which the ICs and various surface mounted passive circuit elements are attached.

The receiver section includes an internal shield for the electrical and optical subassemblies to ensure high immunity to external EMI fields.

The outer housing including the LC ports is molded of filled nonconductive plastic to provide mechanical strength. The solder posts of the Avago design are isolated from the internal circuit of the transceiver.

The transceiver is attached to a printed circuit board with the ten signal pins and the two solder posts which exit the bottom of the housing. The two solder posts provide the primary mechanical strength to withstand the loads imposed on the transceiver by mating with the LC connector fiber cables.
Ordering Information 1300 nm LED Operating Case Temperature 0 to +70 °C HFBR-5961LZ/HFBR-5961GZ 1300 nm LED Operating Case Temperature -40 to +85 °C HFBR-5961ALZ/HFBR-5961AGZ

For product information and a complete list of distributors, please go to our web site Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright 2005-2009 Avago Technologies. All rights reserved. AV02-0820EN - April 24, 2009

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived HFBR-5961GZ Datasheet file may be downloaded here without warranties.

Datasheet ID: HFBR-5961GZ 520312