AMMC-3040 18 - 36 GHz Double-Balanced Mixer with Integrated LO Amplifier/Multiplier
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AMMC-3040 18 - 36 GHz Double-Balanced Mixer with Integrated LO Amplifier/Multiplier Data Sheet Chip Size 2520 x 760 µm x mils Chip Size Tolerance ± 10 µm ± mils Chip Thickness 100 ± 10 µm 4 ± mils Pad Dimensions 75 x 75 µm 3 ± mils The AMMC-3040 is a broadband Double-Balanced Mixer DBM with an integrated high-gain LO amplifier. This MMIC can be used as either an up converter or down converter in microwave or millimeter wave applications. If desired, the LO amplifier can be biased to function as a frequency multiplier to enable second harmonic mixing of the LO input. The mixer section ofthe AMMC-3040 is fabricated using a suspended metal system to create a unique, broadside-coupled balun structure patent pending to achieve exceptional bandwidth. The MMIC provides repeatable conversion loss without tuning, making it highly suitable for automated assembly processes. For improved reliability and moisture protection, the die is passivated at the active areas. AMMC-3040 Absolute Maximum Ratings[1] Symbol Parameters/Conditions Units Min. Max. VD1, 2, 3, 4 VG1, 2, 3, 4 Idd Tch Tb Tstg Tmax Positive Drain Voltage Gate Voltage Total Drain Current Operating Channel Temp. Operating Backside Temp. Storage Case Temp. Maximum Assembly Temp. 60 sec max °C -55 °C -65 5 550 +160 +165 +300 Note: Operation in excess of any one of these conditions may result in permanent damage to this device. • High IIP3 +23 dBm • Wide bandwidth • RF 18-36 GHz • LO 18-36 GHz • IF DC-3 GHz • Fundamental or subharmonic mixing • Up or down converter • Conversion loss dB • P1dB +17 dBm • Low LO drive power +2 dBm • Usable to 42 GHz • Point-to-point radio • LMDS • SATCOM Note These devices are ESD sensitive. The following precautions are strongly recommended Ensure that an ESD approved carrier is used when dice are transported from one destination to another. Personal grounding is to be worn at all times when handling these devices. AMMC-3040 DC Specifications/Physical Properties[1] Parameters and Test Conditions Units Min. Typical Max. VD1, 2, 3, 4 Drain Supply Operating Voltage First Stage Drain Supply Current, Vdd = V, Vg1 = V ID2, 3, 4 Total Drain Supply Current for Stages 2, 3 and 4 Vdd = V, Vgg = V VG1, 2, 3, 4 Gate Supply Operating Voltages Idd = 250 mA Pinch-Off Voltage Vdd = V, Idd < 10 mA ch-b Thermal Resistance[2] Backside Temp. Tb = 25°C °C/W Notes Measured in wafer form with Tchuck = 25°C. Except Channel-to-backside Thermal Resistance = 58°C/Ω at Tchannel Tc =150°C as measured using the liquid crystal method. Thermal Resis- tance at backside temperature Tb = 25 °C calculated from measured data. AMMC-3040 RF Specifications Zo = 50 Ω, Tb = 25°C, IF Output = 2 GHz, LO Input Power = +2 dBm, RF Input Power = -20 dBm, except as noted. Vdd = V, Idd = 250 mA Ordering Information: AMMC-3040-W10 = 10 devices per tray AMMC-3040-W50 = 50 devices per tray For product information and a complete list of distributors, please go to our website: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright 2005-2008 Avago Technologies Limited. All rights reserved. Obsoletes 5989-3932EN AV02-1040EN - June 24, 2008 |
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