TCS3490EVM

TCS3490EVM Datasheet


TCS3490

Part Datasheet
TCS3490EVM TCS3490EVM TCS3490EVM (pdf)
Related Parts Information
TCS34903FN TCS34903FN TCS34903FN
TCS34907FN TCS34907FN TCS34907FN
PDF Datasheet Preview
TCS3490

Color Light-to-Digital Converter

The TCS3490 device provides color and IR red, green, blue, clear and IR light sensing. The color sensing provides for improved accuracy lux and color temperature measurements typically used to adjust the backlight intensity and correct the display color gamut. Additionally it can be used for light source type detection as it reports the IR content of the light.
Ordering Information and Content Guide appear at end of datasheet.

Figure 1 Added Value of Using TCS3490

Key Benefits & Features

The benefits and features of TCS3490, Color Light-to-Digital Converter are listed below:

Single Device Integrated Optical Solution

Color Temperature and Ambient Light Sensing Equal Response to 360 degree Incident Light Ideal for Operation Behind Dark Glass Light Source Detection
• RGBC and ALS Support
• Power Management Features
• Programmable Gain & Integration Time
• 1,000,000:1 Dynamic Range
• Circular Segmented RGBC Photodiode
• Very High Sensitivity
• RGBC + IR sensor

The TCS3490 applications include
• Ambient Light Sensing
• Color Temperature Sensing
• Industrial Process Control
• Medical Diagnostics
ams Datasheet [v1-08] 2015-Apr-30

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Figure 2 TCS3490 Block Diagram

TCS3490 − General Description

Block Diagram

The functional blocks of this device for reference are shown below:

IR passband filter

UV & IR stopband
filter Clear

Green

Blue

RGBC Control

Clear ADC

Clear Data

Red ADC

Red Data

Green ADC

Green Data

Blue ADC

Blue Data

Interrupt

Upper Limit Lower Limit

Interface

INT SCL SDA

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ams Datasheet [v1-08] 2015-Apr-30

TCS3490 − Pin Assignment

Pin Assignment

Pin Diagram Top View Package FN Dual Flat No-Lead. Package Drawing is not to scale.
VBUS in the above figures refers to the bus voltage which is either VDD or V. Be sure to apply the specified bus voltage shown in the Ordering & Contact Information for the specific device being used.

The signals and the Interrupt are open-drain outputs and require pull−up resistors. The pull-up resistor RP value is a function of the bus speed, the bus voltage, and the capacitive load. The ams EVM running at 400 kbps, uses 1.5-kΩ resistors. A 10-kΩ pull-up resistor RPI can be used for the interrupt line.
ams Datasheet [v1-08] 2015-Apr-30

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TCS3490 − PCB Pad Layout

PCB Pad Layout

PCB Layout Suggested land pattern based on the IPC-7351B Generic Requirements for Surface Mount Design and Land Pattern Standard 2010 for the small outline no-lead SON package.

Suggested PCB pad layout guidelines for the surface mount module are shown. Flash Gold is recommended as a surface finish for the landing pads.

Figure 34 Suggested PCB Layout

Note s and/or Footnote s All linear dimensions are in millimeters. This drawing is subject to change without notice.

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ams Datasheet [v1-08] 2015-Apr-30

TCS3490 − Package Drawings & Markings

Package Drawings & Markings

Figure 35 IC Package Mechanical Drawing
&/ &/

Green

Note s and/or Footnote s All linear dimensions are in micrometers. Dimension tolerance is ±20 um unless otherwise noted. The die is centered within the package within a tolerance of ±75 um. Package top surface is molded with an electrically non-conductive clear plastic compound having an index of refraction of Contact finish is Copper Alloy A194 with pre-plated NiPdAu lead finish. This package contains no lead Pb . This drawing is subject to change without notice.
ams Datasheet [v1-08] 2015-Apr-30

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Package Mechanical Data

Figure 36 Carrier Tape & Reel Information

TCS3490 − Package Mechanical Data

Note s and/or Footnote s All linear dimensions are in millimeters. Dimension tolerance is ± mm unless otherwise noted. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly. Symbols on drawing Ao, Bo, and Ko are defined in ANSI EIA Standard 481−B Each reel is 330 millimeters in diameter and contains 2500 parts. Packaging tape and reel conform to the requirements of EIA Standard 481−B. In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape. This drawing is subject to change without notice. The device pin 1 is located in the upper left corner inside the T&R pockets.

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ams Datasheet [v1-08] 2015-Apr-30

TCS3490 − Soldering & Storage Information

Soldering & Storage Information

Figure 37 Solder Reflow Profile

The FN package has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate.

The solder reflow profile describes the expected maximum heat exposure of components during the solder reflow process of product on a PCB. Temperature is measured on top of component. The components should be limited to a maximum of three passes through this solder reflow profile.

Parameter

Average temperature gradient in preheating Soak time above 217 ºC T1 Time above 230 ºC T2 Time above Tpeak - 10 ºC T3 Peak temperature in reflow Temperature gradient in cooling

Reference
tsoak t1 t2 t3

Tpeak

Device
ºC/sec 2 to 3 minutes

Max 60 sec Max 50 sec Max 10 sec
260 ºC Max -5 ºC/sec

Figure 38 Solder Reflow Profile Graph
TCS3490 − Ordering & Contact Information
Ordering & Contact Information The device is packaged in a small OFN Optical FN package
which is 2mm x 2.4mm.
Figure 39 Ordering Information
Ordering Code

TCS34901FN 1 TCS34903FN

TCS34905FN 1 TCS34907FN

Address
0x39 0x29

Interface

VBUS = VDD Interface bus = 1.8V Interface VBUS = VDD Interface bus = 1.8V Interface

Delivery Form

FN-6 FN-6 FN-6 FN-6

Note s and/or Footnote s Contact ams for availability.

Buy our products or get free samples online at:

Technical Support is available at:

Provide feedback about this document at:

For further information and requests, e-mail us at:

For sales offices, distributors and representatives, please visit:

Headquarters ams AG Tobelbaderstrasse 30 8141 Unterpremstaetten Austria, Europe

Tel +43 0 3136 500 0 Website:
ams Datasheet [v1-08] 2015-Apr-30

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TCS3490 − RoHS Compliant & ams Green Statement

RoHS Compliant & ams Green Statement

RoHS The term RoHS compliant means that ams AG products fully comply with current RoHS directives. Our semiconductor products do not contain any chemicals for all 6 substance categories, including the requirement that lead not exceed by weight in homogeneous materials. Where designed to be soldered at high temperatures, RoHS compliant products are suitable for use in specified lead-free processes.
ams Green RoHS compliant and no Sb/Br ams Green defines that in addition to RoHS compliance, our products are free of Bromine Br and Antimony Sb based flame retardants Br or Sb do not exceed by weight in homogeneous material .

Important Information The information provided in this statement represents ams AG knowledge and belief as of the date that it is provided. ams AG bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. ams AG has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ams AG and ams AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

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ams Datasheet [v1-08] 2015-Apr-30

TCS3490 − Copyrights & Disclaimer

Copyrights & Disclaimer

Copyright ams AG, Tobelbader Strasse 30, 8141 Unterpremstaetten, Austria-Europe. Trademarks Registered. All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner.

Devices sold by ams AG are covered by the warranty and patent indemnification provisions appearing in its General Terms of Trade. ams AG makes no warranty, express, statutory, implied, or by description regarding the information set forth herein. ams AG reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with ams AG for current information. This product is intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by ams AG for each application. This product is provided by ams AG “AS IS” and any express or implied warranties, including, but not limited to the implied warranties of merchantability and fitness for a particular purpose are disclaimed.
ams AG shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of ams AG rendering of technical or other services.
ams Datasheet [v1-08] 2015-Apr-30

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Document Status

TCS3490 − Document Status

Document Status Product Status

Definition

Product Preview

Pre-Development

Information in this datasheet is based on product ideas in the planning phase of development. All specifications are design goals without any warranty and are subject to change without notice

Preliminary Datasheet
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ams Datasheet [v1-08] 2015-Apr-30
More datasheets: AT29LV040A-15TI | AT29LV040A-15JI | AT29LV040A-15JC | AT29LV040A-25TC | AT29LV040A-25TI | AT29LV040A-15TC | AT29LV040A-20JC | AT29LV040A-20JI | TCS34903FN | TCS34907FN


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Datasheet ID: TCS3490EVM 519815