CMV4000-2E12M1PP

CMV4000-2E12M1PP Datasheet

CMV4000 Datasheet

Part	Datasheet
CMV4000-2E12M1PP	CMV4000-2E12M1PP (pdf)

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CMV4000 Datasheet Reference Page 1 of 48 Megapixel machine vision CMOS image sensor Datasheet 2010 CMOSIS NV CMV4000 Datasheet Change record Reference Page 2 of 48 Issue 1 2 Date Modification 06/05/09 Origination 12/11/09 p 29/30/33 11/01/10 Adjusted min input frequency section Changed 3.0V to 2.8V for Vpix 14/01/10 Adjusted pin width in package drawing 29/03/10 Added spectral response Added spectral response for color devices Updated specifications for version 2 devices Changed VDD18 to VDD20 Added ordering info Added handling and soldering procedures Added recommended and adjustabel register settings 22/7/10 Frame rate calculation added 2/8/10 in 12 bit mode added 1/9/10 Added exposure time offset x register73 x clk_per x 129 17/9/10 Added Vtf_l1 to GND remark 19/10/10 Added E12 spectral response curve and part numbers Disclaimer CMOSIS reserves the right to change the product, specification and other information contained in this document without notice. Although CMOSIS does its best efforts to provide correct information, this is not warranted. 2010 CMOSIS NV CMV4000 Datasheet Table of Contents Reference Page 3 of 48 1 Introduction 6 Overview 6 Features 6 Specifications 6 Connection diagram 7 2 Sensor architecture 8 Pixel array 8 Analog front end 9 LVDS block 9 Sequencer 9 SPI interface 9 Temperature sensor 9 3 Driving the CMV4000 1 1 Supply settings 11 Biasing 11 Digital input pins 11 Input clock 12 Frame rate calculation 12 12 Reset sequence 13 SPI programming 14 SPI write 1 4 SPI read 1 5 Requesting a frame 15 Internal exposure control 1 5 External exposure time 1 6 4 Reading out the sensor 1 7 LVDS data outputs 17 pixel timing 17 Readout timing 18 10 bit mode 1 8 16 Output channels 1 8 8 output channels 1 8 4 output channels 1 8 2 output channels 1 9 2010 CMOSIS NV CMV4000 Datasheet Reference Page 4 of 48 12 bit mode 1 9 16 Output channels 1 9 8 output channels 1 9 4 output channels 1 9 2 output channels 1 9 Pixel remapping 20 16 outputs 2 0 8 outputs 2 0 4 outputs 2 1 2 outputs 2 1 Control channel 22 DVAL, LVAL, FVAL 2 2 Training data 23 5 Image sensor programming 2 4 Exposure modes 24 High dynamic range modes 24 Interleaved 2 4 Piecewise linear response 2 5 Piecewise linear response with internal exposure mode 2 6 piecewise linear response with external exposure mode 2 6 2 7 Windowing 28 Single window 2 8 Multiple windows 2 8 Image flipping 30 Image subsampling 30 Simple subsampling 3 0 advanced subsampling 3 0 Number of frames 31 output mode 31 Training pattern 32 or mode 32 Data rate 32 Power control 32 Offset and gain 32 Offset 3 2 Gain 3 3 Recommended register settings 33 Adjusting registers for optimal performance 3 3 2010 CMOSIS NV CMV4000 Datasheet Reference Page 5 of 48 6 Register overview 3 4 7 Mechanical specifications 3 7 Package drawing 37 Assembly drawing 38 Cover glass 38 Color filters 39 8 Spectral response 4 0 9 Pin list 4 1 10 Specification overview 4 3 11 Ordering info 4 5 12 Handling and soldering procedure 4 6 Soldering 46 Manual 4 6 Wave soldering 4 6 Reflow soldering 4 6 Soldering Recommendations 4 7 Handling image sensors 47 4 7 Glass cleaning 4 7 Image sensor storing 4 7 13 Additional Information 4 8 2010 CMOSIS NV CMV4000 Datasheet Reference Page 6 of 48 1 INTRODUCTION OVERVIEW The CMV4000 is a high speed CMOS image sensor with 2048 by 2048 pixels 1 optical inch developed for machine vision applications. The image array consists of shutter pixels which allow exposure during read out, while performing CDS operation. The image sensor has sixteen or digital LVDS outputs serial . The image sensor also integrates a programmable gain amplifier and offset regulation. Each channel runs at 480 Mbps maximum which results in 180 fps frame rate at full resolution. Higher frame rates can be achieved in windowing mode or mode. These modes are all programmable using the SPI interface. All internal exposure and read out timings are generated by a programmable sequencer. External triggering and exposure programming is also possible. Extended optical dynamic range can be achieved by multiple integrated high dynamic range modes. FEATURES x 2048 * 2048 pitch x frame rate 180 Frames/sec x row windowing capability x mirroring function x Master clocks and LVDS x 16 multiplexable to 8, 4 and 2 at reduced frame rate x LVDS control line with frame and line information x LVDS DDR output clock to sample data on the receiving end x 10 bit ADC output at maximum frame rate, 12 bit ADC at reduced frame rate x Multiple High Dynamic Range modes supported x On chip temperature sensor x On chip timing generation x x Ceramic µPGA package 95 pins x 3.3V signaling x Available in panchromatic and Bayer RGB SPECIFICATIONS x Full well charge x Sensitivity V/lux.s with microlenses x Dark noise RMS x Conversion factor 10 bit mode at unity gain x SNR 60 dB x Extended dynamic range Piecewise linear response or interleaved x Parasitic light sensitivity 1/50 000 x Dark current 125 e/s 25C die temp x Fixed pattern noise <1 LSB 10 bit mode, of full swing, standard deviation on full image x Power consumption 600mW 2010 CMOSIS NV CMV4000 Datasheet CONNECTION DIAGRAM 2.0V 3.3V 3.0V CLK_IN SYS_RES SPI_EN SPI_CLK SPI_IN SPI_OUT Frame_REQ LVDS_CLK_N LVDS_CLK_P CMV4000 Image sensor Decoupling pins Reference Page 7 of 48 16 LVDS outputs LVDS output clock LVDS control signal All ground pins Figure 1 Connection diagram for the CMV4000 image sensor Please look at the pin list for a detailed description of all pins and their proper connections. Some optional pins are not displayed on the figure above. The exact pin numbers can be found in the pin list and on the package drawing. 2010 CMOSIS NV CMV4000 Datasheet 2 SENSOR ARCHITECTURE External driving signals sequencer Reference Page 8 of 48 Pixel 2047,2047 Active pixel area 2048 rows 11 ORDERING INFO Part Number Epi Thickness 5 µm 5 µm 12µm Chroma mono RGB Bayer mono Microlens yes yes yes Package Glass plain plain plain On request the package and cover glass can be customized. For options, pricing and delivery time please contact 2010 CMOSIS NV CMV4000 Datasheet 12 HANDLING AND SOLDERING PROCEDURE Reference Page 46 of 48 SOLDERING MANUAL SOLDERING Use partial heating method and use a soldering iron with temperature control. The soldering iron tip temperature is not to exceed 350ºC with 270°C maximum pin temperature, 2 seconds maximum duration per pin. Avoid global heating of the ceramic package during soldering. Failure to do so may alter device performance and reliability. WAVE SOLDERING Wave soldering is possible but not recommended. Solder dipping can cause damage to the glass and harm the imaging capability of the device. See the figure below for the wave soldering profile. Max 10 s 260 Temperature C Temperature C 25 Time s REFLOW SOLDERING The figure below shows the maximum recommended thermal profile for a reflow soldering system. If the temperature/time profile exceeds these recommendations, damage to the image sensor can occur. 60 to 120 seconds 10 to 20 sec 260 220 200 150 60 to 180 seconds 25 Maximum 6 min Time s 2010 CMOSIS NV CMV4000 Datasheet Reference Page 47 of 48 SOLDERING RECOMMENDATIONS Image sensors with filter arrays CFA and are especially sensitive to high temperatures. Prolonged heating at elevated temperatures may result in deterioration of the performance of the sensor. Best solution will be flow soldering or manual soldering of a socket through hole or BGA and plug in the sensor at latest stage of the assembly/test process. The BGA solution allows more flexibility for the routing of the camera PCB. HANDLING IMAGE SENSORS

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CMV4000 Datasheet

Reference Page 1 of 48
Megapixel machine vision CMOS image sensor

Datasheet
2010 CMOSIS NV
CMV4000 Datasheet
Change record

Reference Page 2 of 48

Issue 1 2

Date

Modification
06/05/09 Origination
12/11/09 p 29/30/33
11/01/10 Adjusted min input frequency section Changed 3.0V to 2.8V for Vpix
14/01/10 Adjusted pin width in package drawing
29/03/10 Added spectral response Added spectral response for color devices Updated specifications for version 2 devices Changed VDD18 to VDD20 Added ordering info Added handling and soldering procedures Added recommended and adjustabel register settings
22/7/10 Frame rate calculation added
2/8/10 in 12 bit mode added
1/9/10 Added exposure time offset x register73 x clk_per x 129
17/9/10 Added Vtf_l1 to GND remark
19/10/10 Added E12 spectral response curve and part numbers

Disclaimer CMOSIS reserves the right to change the product, specification and other information contained in this document without notice. Although CMOSIS does its best efforts to provide correct information, this is not warranted.
2010 CMOSIS NV
CMV4000 Datasheet

Table of Contents

Reference Page 3 of 48
1 Introduction 6 Overview 6 Features 6 Specifications 6 Connection diagram 7
2 Sensor architecture 8 Pixel array 8 Analog front end 9 LVDS block 9 Sequencer 9 SPI interface 9 Temperature sensor 9
3 Driving the CMV4000 1 1 Supply settings 11 Biasing 11 Digital input pins 11 Input clock 12 Frame rate calculation 12 12 Reset sequence 13 SPI programming 14 SPI write 1 4 SPI read 1 5 Requesting a frame 15 Internal exposure control 1 5 External exposure time 1 6
4 Reading out the sensor 1 7
LVDS data outputs 17
pixel timing 17
Readout timing 18 10 bit mode 1 8 16 Output channels 1 8 8 output channels 1 8 4 output channels 1 8 2 output channels 1 9
2010 CMOSIS NV
CMV4000 Datasheet

Reference Page 4 of 48
12 bit mode 1 9 16 Output channels 1 9 8 output channels 1 9 4 output channels 1 9 2 output channels 1 9
Pixel remapping 20 16 outputs 2 0 8 outputs 2 0 4 outputs 2 1 2 outputs 2 1
Control channel 22 DVAL, LVAL, FVAL 2 2
Training data 23
5 Image sensor programming 2 4 Exposure modes 24 High dynamic range modes 24 Interleaved 2 4 Piecewise linear response 2 5 Piecewise linear response with internal exposure mode 2 6 piecewise linear response with external exposure mode 2 6 2 7 Windowing 28 Single window 2 8 Multiple windows 2 8 Image flipping 30 Image subsampling 30 Simple subsampling 3 0 advanced subsampling 3 0 Number of frames 31 output mode 31 Training pattern 32 or mode 32 Data rate 32 Power control 32 Offset and gain 32 Offset 3 2 Gain 3 3 Recommended register settings 33 Adjusting registers for optimal performance 3 3
2010 CMOSIS NV
CMV4000 Datasheet

Reference Page 5 of 48
6 Register overview 3 4
7 Mechanical specifications 3 7 Package drawing 37 Assembly drawing 38 Cover glass 38 Color filters 39
8 Spectral response 4 0
9 Pin list 4 1
10 Specification overview 4 3
11 Ordering info 4 5
12 Handling and soldering procedure 4 6
Soldering 46 Manual 4 6 Wave soldering 4 6 Reflow soldering 4 6 Soldering Recommendations 4 7
Handling image sensors 47 4 7 Glass cleaning 4 7 Image sensor storing 4 7
13 Additional Information 4 8
2010 CMOSIS NV
CMV4000 Datasheet

Reference Page 6 of 48
1 INTRODUCTION

OVERVIEW

The CMV4000 is a high speed CMOS image sensor with 2048 by 2048 pixels 1 optical inch developed for machine vision applications. The image array consists of shutter pixels which allow exposure during read out, while performing CDS operation. The image sensor has sixteen or digital LVDS outputs serial . The image sensor also integrates a programmable gain amplifier and offset regulation. Each channel runs at 480 Mbps maximum which results in 180 fps frame rate at full resolution. Higher frame rates can be achieved in windowing mode or mode. These modes are all programmable using the SPI interface. All internal exposure and read out timings are generated by a programmable sequencer. External triggering and exposure programming is also possible. Extended optical dynamic range can be achieved by multiple integrated high dynamic range modes.

FEATURES
x 2048 * 2048 pitch x frame rate 180 Frames/sec x row windowing capability x mirroring function x Master clocks and LVDS x 16 multiplexable to 8, 4 and 2 at reduced frame rate x LVDS control line with frame and line information x LVDS DDR output clock to sample data on the receiving end x 10 bit ADC output at maximum frame rate, 12 bit ADC at reduced frame rate x Multiple High Dynamic Range modes supported x On chip temperature sensor x On chip timing generation x x Ceramic µPGA package 95 pins x 3.3V signaling x Available in panchromatic and Bayer RGB

SPECIFICATIONS
x Full well charge x Sensitivity V/lux.s with microlenses x Dark noise RMS x Conversion factor 10 bit mode at unity gain x SNR 60 dB x Extended dynamic range Piecewise linear response or interleaved x Parasitic light sensitivity 1/50 000 x Dark current 125 e/s 25C die temp x Fixed pattern noise <1 LSB 10 bit mode, of full swing, standard deviation on full image x Power consumption 600mW
2010 CMOSIS NV
CMV4000 Datasheet

CONNECTION DIAGRAM
2.0V 3.3V 3.0V

CLK_IN

SYS_RES

SPI_EN SPI_CLK SPI_IN SPI_OUT

Frame_REQ

LVDS_CLK_N LVDS_CLK_P

CMV4000 Image sensor

Decoupling pins

Reference Page 7 of 48
16 LVDS outputs

LVDS output clock

LVDS control signal

All ground pins

Figure 1 Connection diagram for the CMV4000 image sensor

Please look at the pin list for a detailed description of all pins and their proper connections. Some optional pins are not displayed on the figure above. The exact pin numbers can be found in the pin list and on the package drawing.
2010 CMOSIS NV
CMV4000 Datasheet
2 SENSOR ARCHITECTURE

External driving signals
sequencer

Reference Page 8 of 48

Pixel 2047,2047

Active pixel area 2048 rows
11 ORDERING INFO

Part Number

Epi Thickness
5 µm
5 µm
12µm

Chroma mono RGB Bayer mono

Microlens yes yes yes

Package

Glass
plain
plain
plain

On request the package and cover glass can be customized. For options, pricing and delivery time please contact
2010 CMOSIS NV
CMV4000 Datasheet
12 HANDLING AND SOLDERING PROCEDURE

Reference Page 46 of 48

SOLDERING

MANUAL SOLDERING

Use partial heating method and use a soldering iron with temperature control. The soldering iron tip temperature is not to exceed 350ºC with 270°C maximum pin temperature, 2 seconds maximum duration per pin. Avoid global heating of the ceramic package during soldering. Failure to do so may alter device performance and reliability.

WAVE SOLDERING

Wave soldering is possible but not recommended. Solder dipping can cause damage to the glass and harm the imaging capability of the device. See the figure below for the wave soldering profile.

Max 10 s 260

Temperature C

Temperature C
25 Time s

REFLOW SOLDERING

The figure below shows the maximum recommended thermal profile for a reflow soldering system. If the temperature/time profile exceeds these recommendations, damage to the image sensor can occur.
60 to 120 seconds 10 to 20
sec 260
220 200
150 60 to 180 seconds
25 Maximum 6 min Time s
2010 CMOSIS NV
CMV4000 Datasheet

Reference Page 47 of 48

SOLDERING RECOMMENDATIONS

Image sensors with filter arrays CFA and are especially sensitive to high temperatures. Prolonged heating
at elevated temperatures may result in deterioration of the performance of the sensor. Best solution will be flow soldering or manual soldering of a socket through hole or BGA and plug in the sensor at latest stage of the assembly/test process. The BGA solution allows more flexibility for the routing of the camera PCB.

HANDLING IMAGE SENSORS

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived CMV4000-2E12M1PP Datasheet file may be downloaded here without warranties.

Datasheet ID: CMV4000-2E12M1PP 519792