CMV4000-2E5M1LP

CMV4000-2E5M1LP Datasheet

CMV4000 v2 Datasheet

Part	Datasheet
CMV4000-2E5M1LP	CMV4000-2E5M1LP (pdf)

PDF Datasheet Preview
CMV4000 v2 Datasheet Reference CMV4000-datasheet-v2.13 Page 1 of 65 Megapixel machine vision CMOS image sensor Datasheet 2014 CMOSIS bvba CMV4000 v2 Datasheet Change record Reference CMV4000-datasheet-v2.13 Page 2 of 65 Issue 1 2 Date 06/05/2009 12/11/2009 11/01/2010 14/01/2010 29/03/2010 22/7/2010 2/8/2010 1/9/2010 17/9/2010 19/10/2010 11/01/2011 1/2/2011 25/3/2011 13/4/2011 20/5/2011 17/11/2011 24/02/2012 13/03/2012 Modification Origination Corrected register address of sub_s[7:0] to ‘35’ p 29/30/33 Adjusted min input frequency section Adjusted pin width in package drawing Added spectral response Added spectral response for color devices Updated specifications for version 2 devices Changed VDD18 to VDD20 Added ordering info Added handling and soldering procedures Removed “confidential” in footer Added recommended and adjustable register settings Frame rate calculation added Read-out in 12 bit mode added exposure time offset x register73 x clk_per x 129 Added Vtf_l1 to GND remark Added E12 spectral response curve and part numbers Added RGB Bayer pattern details Added electrical IO specifications Updated reflow soldering profile Changed tilt to degrees, updated spectral response, changed exposure time formula Changed 12 bit read-out mode removed 16 and 8 outputs Added frame rate calculation and examples Added: 2014 CMOSIS bvba CMV4000 v2 Datasheet Reference CMV4000-datasheet-v2.13 Page 3 of 65 Date 24/05/2012 30/07/2012 01/08/2013 Added: Modification - Self-heating - Supply peaks and decoupling - I/O capacitance - Power supplies startup sequence - Overview outputs vs. channel mapping - Actual gain vs. register setting for multiple clock speeds - Typical response curve Updated package drawing PGA dim. to Added - PLR Vlow2/3 enable bit - Sampling of digital inputs on rising CLK_IN - Details on LVDS data out in multiplex modes - CTR channel bits on Tdig1/2 pins - Evaluation kit available - Minimum time between Frane_req pulses in internal mode - Temperature sensor calibration example Updated - Bayer pattern figure pixel 0,0 green  red . No actual device change compared to previous devices. - Supply noise influence - Control bit INTE1/2 no FOT overlap - FOT and Read-out time rounding - Detailed timing of control channel figure - LVDS clock delay figure CLK_IN period - SPI timing from SPI upload to FRAME_REQ 1µs  1ms Removed - Reference errors Added - Pin head dimensions to package drawing - Tdig1 and Tdig2 addresses to register overview - Recommended FOT register settings to register overview - Angular response curve - Minimum exposure value Updated - Training pattern of control channel - Text and figure of Image flipping chapter - Text and figure of Color filter chapter - Assembly drawing now refers to pixel 0,0 , added dimensions, transparent view, pin numbers and corrected tilt of die - Supply settings table peak current calculation typical values to recommended values supply voltage range - Connection diagram 2.0V to 2.1V - Response curve replaced figure - Temperature sensor figure now refers to pixel 0,0 - Start-up sequence time after SPI upload described more accurately - LVDS driver specification Voc dependency 2014 CMOSIS bvba CMV4000 v2 Datasheet Reference CMV4000-datasheet-v2.13 Page 4 of 65 Date 3/12/2013 28/3/2014 28/01/2015 Modification Added - Skew limits for LVDS clock - Explanation of register 125 Updated - Reset sequence figure, added settling time - Assembly drawing corrected pixel 0,0 location, added a dimension - Mechanical drawing corrected cavity dimensions higher resolution - Recommended register settings all registers in recommended settings table now have their description in the register overview as well - Figure 29 corrected aspect ratio - Temperature sensor location figure Added - Register 73 can be lowered to 10, when required for very short integration times - The pin list description now lists what pins are optional - Recommendation for unused pins in pinning chapter - Description of i_lvds register, lowering this can be useful for meeting EMC standards - All necessary register names are now in the register overview - All register names in Chapter 5 now include bit numbers - Part numbers for all package types are now included in the Ordering Information table Updated - Register overview some new descriptions and references - New figures for transmittance, QE, and response are easier to read - “color” register is now named mono, to better fit the description - Pin list table is now sorted on function rather than pin number - Specification overview in Chapter is now clearer - Description for optimizing register settings is now more complete - Description for start-up and reset sequence - Vtglow2 and Vtglow3 are 6 bits long, instead of 7 - Description of settling time should be clearer now Removed - Pixel coordinates on block diagram are removed as they were causing confusion Added - Part numbers and specifications for the new LCC package Updated - The power figure in the Specification Overview is now more accurate it considers the sensor configuration - The exposure time is shortest in external exposure mode, so this mode is added to the calculation. - FRAME_REQ pin is level sensitive, not edge sensitive - Maximum number of frames is 65535, not 65548 - Corrected note that said that the exposure starts directly after F_REQ, there is a delay between the two - Serial numbers for E12 devices are corrected, they previously didn’t show the sensor version - Corrected calibration procedure, step 2 should be repeated, not step Removed - Nr_slopes2 register from overview, this is an unused register. - Scratch/dig/bubble spec for cover glass 2014 CMOSIS bvba CMV4000 v2 Datasheet Reference CMV4000-datasheet-v2.13 Page 5 of 65 Date 18/06/2015 Modification Updated - LCC pin layout now correctly says it’s the bottom view, not the top - LCC Product number now for AR coated glass only Added - Transmittance curve for AR coated glass Disclaimer CMOSIS reserves the right to change the product, specification and other information contained in this document without notice. Although CMOSIS does its best efforts to provide correct information, this is not warranted. 2014 CMOSIS bvba CMV4000 v2 Datasheet Reference CMV4000-datasheet-v2.13 Page 6 of 65 Table of Contents 1 Introduction Overview Features Specifications Connection diagram 2 Sensor architecture Pixel Analog front LVDS Sequencer SPI interface Temperature 3 Driving the CMV4000 Supply Biasing Digital input electrical I/O Digital I/O CMOS/TTL DC specifications see pin list for specific pins TIA/EIA-644A LVDS driver specifications OUTx_N/P, OUTCLK_N/P, OUTCTR_N/P TIA/EIA-644A LVDS receiver specifications Input Frame rate calculation Start-up sequence Reset SPI programming SPI write SPI Requesting a frame Internal exposure control External exposure time 4 Reading out the sensor LVDS data outputs Low-level pixel timing Read-out timing 2014 CMOSIS bvba CMV4000 v2 Datasheet Reference CMV4000-datasheet-v2.13 Page 7 of 65 10 bit 12 bit Pixel remapping 16 Outputs 8 4 2 Overview Control channel DVAL, LVAL, Training data 5 Image sensor Exposure modes High dynamic range modes Interleaved read-out Piecewise linear Multi-frame read-out Single Multiple windows Image flipping Image Simple Advanced subsampling Number of frames Output mode Training 10-bit or 12-bit Data rate Power control Offset and gain Offset Recommended register settings Adjusting registers for optimal performance 6 Register overview 7 Mechanical specifications 2014 CMOSIS bvba CMV4000 v2 Datasheet Reference CMV4000-datasheet-v2.13 Page 8 of 65 Package drawings 95 pins µPGA and 92 pins LCC Assembly 95 pins µPGA and 92 pins LCC Cover glass Color filters 8 Response curve 9 Spectral 5µm epi 12µm epi 10 Angular response 11 Pinning Pin list µPGA and LGA pin LCC pin layout 12 Specification overview 13 Ordering information 14 Handling and soldering procedure Soldering Manual soldering Wave soldering Reflow soldering Handling image sensors Glass cleaning Image sensor storing 15 Evaluation kit 16 Additional 2014 CMOSIS bvba CMV4000 v2 Datasheet Reference CMV4000-datasheet-v2.13 Page 9 of 65 1 INTRODUCTION OVERVIEW The CMV4000 is a high speed CMOS image sensor with 2048 by 2048 pixels 1 optical inch developed for machine vision applications. The image array consists of 5.5um x 5.5um pipelined global shutter pixels which allow exposure during read-out, while performing CDS operation. The image sensor has sixteen 10- or 12-bit digital LVDS outputs serial . The image sensor also integrates a programmable gain amplifier and offset regulation. Each channel runs at 480 Mbps maximum which results in 180 fps frame rate at full resolution. Higher frame rates can be achieved in row-windowing mode or row-subsampling mode. These modes are all programmable using the SPI interface. All internal exposure and read-out timings are generated by a programmable on-board sequencer. External triggering and exposure programming is also possible. Extended optical dynamic range can be achieved by multiple integrated high dynamic range modes. • Capability to define up to 8 different windows • Horizontal and vertical mirroring function • Multiplexable output channels 16, 8, 4 or 2 channel output possible • LVDS control channel with read-out and frame information • DDR LVDS output clock to sample data on the receiving end • Selectable ADC Resolution choose between maximum frame rate 10bit or better image quality 12bit • Multiple High Dynamic Range options • Configurable subsampling modes • On-chip temperature sensor • On-chip timing generation • Sensor controllable via SPI-interface • Available as panchromatic or with RGB Bayer-filter SPECIFICATIONS • Full well charge 13.5Ke• Sensitivity V/lux.s with microlenses 550nm • Dark noise 13e- RMS • Conversion gain 0.075LSB/e- 10 bit mode at unity gain • Dynamic range 60dB • Parasitic light sensitivity 1/50000 • Dark current 125 e-/s 25°C die temperature • Fixed pattern noise <1 LSB 10 bit mode, of full swing, standard deviation on full image • Power consumption 550mW to 1200mW • 3.3V signaling • 2048 by 2048 active pixels on a 5.5µm pitch • Maximum frame rate of 180FPS • Range of input clocks is 5 to 48MHz Master clock and 50 to 480MHz LVDS clock • Range of custom ceramic packages available 95 pins µPGA or LGA, or 92 pins LCC 2014 CMOSIS bvba CMV4000 v2 Datasheet CONNECTION DIAGRAM 2.1V 3.3V 3.0V CLK_IN SYS_RES SPI_EN SPI_CLK SPI_IN SPI_OUT FRAME_REQ LVDS_CLK_N LVDS_CLK_P CMV4000 Image sensor Decoupling pins Reference CMV4000-datasheet-v2.13 Page 10 of 65 16 LVDS outputs LVDS output clock LVDS control signal All ground pins Figure 1 Connection diagram for the CMV4000 image sensor Please look at the pin list for a detailed description of all pins and their proper connections. Some optional pins are not displayed on the figure above. The exact pin numbers can be found in the pin list and on the package drawing. 2014 CMOSIS bvba CMV4000 v2 Datasheet 2 SENSOR ARCHITECTURE Reference CMV4000-datasheet-v2.13 Page 11 of 65 External driving signals sequencer Input clock Active pixel area 2048 rows 2048 columns SPI signals Temp sensor Analog front end AFE gain, offset, ADCs LVDS block drivers, multiplexers 16, 8, 4 or 2 ouputs Figure 2 Sensor block diagram 13 ORDERING INFORMATION Part Number CMV4000-2E5M1PP CMV4000-2E5M1LP CMV4000-2E5M1CA CMV4000-2E5C1PP CMV4000-2E5C1LP CMV4000-2E5C1CA CMV4000-2E12M1PP CMV4000-2E12M1LP CMV4000-2E12M1CA Epi Thickness 5µm 5µm 5µm 5µm 5µm 5µm 12µm 12µm 12µm Chroma Mono RGB Bayer RGB Bayer RGB Bayer Mono Reference CMV4000-datasheet-v2.13 Page 61 of 65 Microlens Yes Package Ceramic 95p uPGA Ceramic 95p LGA Ceramic 92p LCC Ceramic 95p uPGA Ceramic 95p LGA Ceramic 92p LCC Ceramic 95p uPGA Ceramic 95p LGA Ceramic 92p LCC Glass Plain AR coated Plain AR coated Plain AR coated On request the package and cover glass can be customized. For options, pricing and delivery times please contact 2014 CMOSIS bvba CMV4000 v2 Datasheet Reference CMV4000-datasheet-v2.13 Page 62 of 65 14 HANDLING AND SOLDERING PROCEDURE SOLDERING MANUAL SOLDERING Use partial heating method and use a soldering iron with temperature control. The soldering iron tip temperature is not to exceed 350ºC with 270°C maximum pin temperature, 2 seconds maximum duration per pin. Avoid global heating of the ceramic package during soldering. Failure to do so may alter device performance and reliability. WAVE SOLDERING Wave soldering is possible but not recommended. Solder dipping can cause damage to the glass and harm the imaging capability of the device. See Figure 58 for the wave soldering profile. Max 10 s 260 Temperature C 25 Time s Figure 58 Wave solder profile 2014 CMOSIS bvba CMV4000 v2 Datasheet Reference CMV4000-datasheet-v2.13 Page 63 of 65 REFLOW SOLDERING Figure 59 shows the maximum recommended thermal profile for a reflow soldering system. If the temperature/time profile exceeds these recommendations, damage to the image sensor can occur. 60 to 80 seconds 10 to 20 sec Temperature C 220 200 150 60 to 180 seconds 25 Maximum 6 min Time s Figure 59 Reflow solder profile SOLDERING RECOMMENDATIONS Image sensors with filter arrays CFA and micro-lens are especially sensitive to high temperatures. Prolonged heating at elevated temperatures may result in deterioration of the performance of the sensor. Best solution will be flow soldering or manual soldering of a socket through hole or BGA and plug in the sensor at latest stage of the assembly/test process. The BGA solution allows more flexibility for the routing of the camera PCB. HANDLING IMAGE SENSORS The following are the recommended minimum ESD requirements when handling image sensors. Ground workspace tables, Ground handling personnel wrist straps, special Minimize static charging control humidity, use ionized air, wear GLASS CLEANING When cleaning of the cover glass is needed we recommend the following two methods.

PDF Datasheet Preview

CMV4000 v2 Datasheet

Reference CMV4000-datasheet-v2.13 Page 1 of 65

Megapixel machine vision CMOS image sensor

Datasheet
2014 CMOSIS bvba

CMV4000 v2 Datasheet

Change record

Reference CMV4000-datasheet-v2.13 Page 2 of 65

Issue 1 2

Date 06/05/2009 12/11/2009 11/01/2010 14/01/2010 29/03/2010
22/7/2010 2/8/2010 1/9/2010 17/9/2010 19/10/2010 11/01/2011 1/2/2011 25/3/2011 13/4/2011 20/5/2011 17/11/2011 24/02/2012
13/03/2012
Modification Origination Corrected register address of sub_s[7:0] to ‘35’ p 29/30/33 Adjusted min input frequency section Adjusted pin width in package drawing Added spectral response Added spectral response for color devices Updated specifications for version 2 devices Changed VDD18 to VDD20 Added ordering info Added handling and soldering procedures Removed “confidential” in footer Added recommended and adjustable register settings Frame rate calculation added Read-out in 12 bit mode added exposure time offset x register73 x clk_per x 129 Added Vtf_l1 to GND remark Added E12 spectral response curve and part numbers Added RGB Bayer pattern details Added electrical IO specifications Updated reflow soldering profile Changed tilt to degrees, updated spectral response, changed exposure time formula Changed 12 bit read-out mode removed 16 and 8 outputs Added frame rate calculation and examples Added:
2014 CMOSIS bvba

CMV4000 v2 Datasheet

Reference CMV4000-datasheet-v2.13 Page 3 of 65

Date 24/05/2012 30/07/2012
01/08/2013

Added:

Modification
- Self-heating
- Supply peaks and decoupling
- I/O capacitance
- Power supplies startup sequence
- Overview outputs vs. channel mapping - Actual gain vs. register setting for multiple clock speeds
- Typical response curve

Updated package drawing PGA dim. to

Added - PLR Vlow2/3 enable bit - Sampling of digital inputs on rising CLK_IN - Details on LVDS data out in multiplex modes - CTR channel bits on Tdig1/2 pins - Evaluation kit available - Minimum time between Frane_req pulses in internal mode - Temperature sensor calibration example

Updated - Bayer pattern figure pixel 0,0 green  red . No actual device change compared to previous devices. - Supply noise influence - Control bit INTE1/2 no FOT overlap - FOT and Read-out time rounding - Detailed timing of control channel figure - LVDS clock delay figure CLK_IN period - SPI timing from SPI upload to FRAME_REQ 1µs  1ms

Removed - Reference errors

Added - Pin head dimensions to package drawing - Tdig1 and Tdig2 addresses to register overview - Recommended FOT register settings to register overview - Angular response curve - Minimum exposure value

Updated - Training pattern of control channel - Text and figure of Image flipping chapter - Text and figure of Color filter chapter - Assembly drawing now refers to pixel 0,0 , added dimensions, transparent view, pin numbers and corrected tilt of die - Supply settings table peak current calculation typical values to recommended values supply voltage range - Connection diagram 2.0V to 2.1V - Response curve replaced figure - Temperature sensor figure now refers to pixel 0,0 - Start-up sequence time after SPI upload described more accurately - LVDS driver specification Voc dependency
2014 CMOSIS bvba

CMV4000 v2 Datasheet

Reference CMV4000-datasheet-v2.13 Page 4 of 65

Date 3/12/2013 28/3/2014
28/01/2015

Modification

Added - Skew limits for LVDS clock - Explanation of register 125

Updated - Reset sequence figure, added settling time - Assembly drawing corrected pixel 0,0 location, added a dimension - Mechanical drawing corrected cavity dimensions higher resolution - Recommended register settings all registers in recommended settings table now have their description in the register overview as well - Figure 29 corrected aspect ratio - Temperature sensor location figure
Added - Register 73 can be lowered to 10, when required for very short integration times - The pin list description now lists what pins are optional - Recommendation for unused pins in pinning chapter - Description of i_lvds register, lowering this can be useful for meeting EMC standards - All necessary register names are now in the register overview - All register names in Chapter 5 now include bit numbers - Part numbers for all package types are now included in the Ordering Information table

Updated - Register overview some new descriptions and references - New figures for transmittance, QE, and response are easier to read - “color” register is now named mono, to better fit the description - Pin list table is now sorted on function rather than pin number - Specification overview in Chapter is now clearer - Description for optimizing register settings is now more complete - Description for start-up and reset sequence - Vtglow2 and Vtglow3 are 6 bits long, instead of 7 - Description of settling time should be clearer now

Removed - Pixel coordinates on block diagram are removed as they were causing confusion

Added - Part numbers and specifications for the new LCC package

Updated - The power figure in the Specification Overview is now more accurate it considers the sensor configuration - The exposure time is shortest in external exposure mode, so this mode is added to the calculation. - FRAME_REQ pin is level sensitive, not edge sensitive - Maximum number of frames is 65535, not 65548 - Corrected note that said that the exposure starts directly after F_REQ, there is a delay between the two - Serial numbers for E12 devices are corrected, they previously didn’t show the sensor version - Corrected calibration procedure, step 2 should be repeated, not step

Removed - Nr_slopes2 register from overview, this is an unused register. - Scratch/dig/bubble spec for cover glass
2014 CMOSIS bvba

CMV4000 v2 Datasheet

Reference CMV4000-datasheet-v2.13 Page 5 of 65

Date 18/06/2015

Modification

Updated - LCC pin layout now correctly says it’s the bottom view, not the top - LCC Product number now for AR coated glass only

Added - Transmittance curve for AR coated glass

Disclaimer

CMOSIS reserves the right to change the product, specification and other information contained in this document without notice. Although CMOSIS does its best efforts to provide correct information, this is not warranted.
2014 CMOSIS bvba

CMV4000 v2 Datasheet

Reference CMV4000-datasheet-v2.13 Page 6 of 65

Table of Contents
1 Introduction Overview Features Specifications Connection diagram
2 Sensor architecture Pixel Analog front LVDS Sequencer SPI interface Temperature
3 Driving the CMV4000 Supply Biasing Digital input electrical I/O Digital I/O CMOS/TTL DC specifications see pin list for specific pins TIA/EIA-644A LVDS driver specifications OUTx_N/P, OUTCLK_N/P, OUTCTR_N/P TIA/EIA-644A LVDS receiver specifications Input Frame rate calculation Start-up sequence Reset SPI programming SPI write SPI Requesting a frame Internal exposure control External exposure time
4 Reading out the sensor LVDS data outputs Low-level pixel timing Read-out timing
2014 CMOSIS bvba

CMV4000 v2 Datasheet

Reference CMV4000-datasheet-v2.13 Page 7 of 65
10 bit 12 bit Pixel remapping 16 Outputs 8 4 2 Overview Control channel DVAL, LVAL, Training data
5 Image sensor Exposure modes High dynamic range modes Interleaved read-out Piecewise linear Multi-frame read-out Single Multiple windows Image flipping Image Simple Advanced subsampling Number of frames Output mode Training 10-bit or 12-bit Data rate Power control Offset and gain Offset Recommended register settings Adjusting registers for optimal performance
6 Register overview
7 Mechanical specifications
2014 CMOSIS bvba

CMV4000 v2 Datasheet

Reference CMV4000-datasheet-v2.13 Page 8 of 65

Package drawings 95 pins µPGA and 92 pins LCC

Assembly 95 pins µPGA and 92 pins LCC
Cover glass Color filters 8 Response curve 9 Spectral 5µm epi 12µm epi 10 Angular response 11 Pinning Pin list µPGA and LGA pin LCC pin layout 12 Specification overview 13 Ordering information 14 Handling and soldering procedure Soldering

Manual soldering Wave soldering Reflow soldering Handling image sensors Glass cleaning Image sensor storing 15 Evaluation kit 16 Additional
2014 CMOSIS bvba

CMV4000 v2 Datasheet

Reference CMV4000-datasheet-v2.13 Page 9 of 65
1 INTRODUCTION

OVERVIEW

The CMV4000 is a high speed CMOS image sensor with 2048 by 2048 pixels 1 optical inch developed for machine vision applications. The image array consists of 5.5um x 5.5um pipelined global shutter pixels which allow exposure during read-out, while performing CDS operation. The image sensor has sixteen 10- or 12-bit digital LVDS outputs serial . The image sensor also integrates a programmable gain amplifier and offset regulation. Each channel runs at 480 Mbps maximum which results in 180 fps frame rate at full resolution. Higher frame rates can be achieved in row-windowing mode or row-subsampling mode. These modes are all programmable using the SPI interface. All internal exposure and read-out timings are generated by a programmable on-board sequencer. External triggering and exposure programming is also possible. Extended optical dynamic range can be achieved by multiple integrated high dynamic range modes.
• Capability to define up to 8 different windows
• Horizontal and vertical mirroring function
• Multiplexable output channels 16, 8, 4 or 2 channel output possible
• LVDS control channel with read-out and frame information
• DDR LVDS output clock to sample data on the receiving end
• Selectable ADC Resolution choose between maximum frame rate 10bit or better image quality 12bit
• Multiple High Dynamic Range options
• Configurable subsampling modes
• On-chip temperature sensor
• On-chip timing generation
• Sensor controllable via SPI-interface
• Available as panchromatic or with RGB Bayer-filter

SPECIFICATIONS
• Full well charge 13.5Ke• Sensitivity V/lux.s with microlenses 550nm
• Dark noise 13e- RMS
• Conversion gain 0.075LSB/e- 10 bit mode at unity gain
• Dynamic range 60dB
• Parasitic light sensitivity 1/50000
• Dark current 125 e-/s 25°C die temperature
• Fixed pattern noise <1 LSB 10 bit mode, of full swing, standard deviation on full image
• Power consumption 550mW to 1200mW
• 3.3V signaling
• 2048 by 2048 active pixels on a 5.5µm pitch
• Maximum frame rate of 180FPS
• Range of input clocks is 5 to 48MHz Master clock and 50 to 480MHz LVDS clock
• Range of custom ceramic packages available 95 pins µPGA or LGA, or 92 pins LCC
2014 CMOSIS bvba

CMV4000 v2 Datasheet

CONNECTION DIAGRAM
2.1V 3.3V 3.0V

CLK_IN SYS_RES

SPI_EN SPI_CLK SPI_IN SPI_OUT

FRAME_REQ

LVDS_CLK_N LVDS_CLK_P

CMV4000 Image sensor

Decoupling pins

Reference CMV4000-datasheet-v2.13 Page 10 of 65
16 LVDS outputs

LVDS output clock

LVDS control signal

All ground pins

Figure 1 Connection diagram for the CMV4000 image sensor Please look at the pin list for a detailed description of all pins and their proper connections. Some optional pins are not displayed on the figure above. The exact pin numbers can be found in the pin list and on the package drawing.
2014 CMOSIS bvba

CMV4000 v2 Datasheet
2 SENSOR ARCHITECTURE

Reference CMV4000-datasheet-v2.13 Page 11 of 65

External driving signals sequencer

Input clock

Active pixel area 2048 rows
2048 columns

SPI signals

Temp sensor

Analog front end AFE gain, offset, ADCs

LVDS block drivers, multiplexers
16, 8, 4 or 2 ouputs

Figure 2 Sensor block diagram
13 ORDERING INFORMATION

Part Number CMV4000-2E5M1PP CMV4000-2E5M1LP CMV4000-2E5M1CA CMV4000-2E5C1PP CMV4000-2E5C1LP CMV4000-2E5C1CA CMV4000-2E12M1PP CMV4000-2E12M1LP CMV4000-2E12M1CA

Epi Thickness 5µm 5µm 5µm 5µm 5µm 5µm 12µm 12µm 12µm

Chroma Mono RGB Bayer RGB Bayer RGB Bayer Mono

Reference CMV4000-datasheet-v2.13 Page 61 of 65

Microlens Yes

Package Ceramic 95p uPGA Ceramic 95p LGA Ceramic 92p LCC Ceramic 95p uPGA Ceramic 95p LGA Ceramic 92p LCC Ceramic 95p uPGA Ceramic 95p LGA Ceramic 92p LCC

Glass Plain AR coated Plain AR coated Plain AR coated

On request the package and cover glass can be customized. For options, pricing and delivery times please contact
2014 CMOSIS bvba

CMV4000 v2 Datasheet

Reference CMV4000-datasheet-v2.13 Page 62 of 65
14 HANDLING AND SOLDERING PROCEDURE

SOLDERING

MANUAL SOLDERING

Use partial heating method and use a soldering iron with temperature control. The soldering iron tip temperature is not to exceed 350ºC with 270°C maximum pin temperature, 2 seconds maximum duration per pin. Avoid global heating of the ceramic package during soldering. Failure to do so may alter device performance and reliability.

WAVE SOLDERING

Wave soldering is possible but not recommended. Solder dipping can cause damage to the glass and harm the imaging capability of the device. See Figure 58 for the wave soldering profile.

Max 10 s 260

Temperature C
25 Time s

Figure 58 Wave solder profile
2014 CMOSIS bvba

CMV4000 v2 Datasheet

Reference CMV4000-datasheet-v2.13 Page 63 of 65

REFLOW SOLDERING

Figure 59 shows the maximum recommended thermal profile for a reflow soldering system. If the temperature/time profile exceeds these recommendations, damage to the image sensor can occur.
60 to 80 seconds
10 to 20 sec

Temperature C
220 200
150 60 to 180 seconds
25 Maximum 6 min Time s

Figure 59 Reflow solder profile

SOLDERING RECOMMENDATIONS

Image sensors with filter arrays CFA and micro-lens are especially sensitive to high temperatures. Prolonged heating at elevated temperatures may result in deterioration of the performance of the sensor. Best solution will be flow soldering or manual soldering of a socket through hole or BGA and plug in the sensor at latest stage of the assembly/test process. The BGA solution allows more flexibility for the routing of the camera PCB.

HANDLING IMAGE SENSORS

The following are the recommended minimum ESD requirements when handling image sensors.

Ground workspace tables, Ground handling personnel wrist straps, special Minimize static charging control humidity, use ionized air, wear

GLASS CLEANING

When cleaning of the cover glass is needed we recommend the following two methods.

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived CMV4000-2E5M1LP Datasheet file may be downloaded here without warranties.

Datasheet ID: CMV4000-2E5M1LP 519790