AT80573QJ0806M

AT80573QJ0806M Datasheet

Product Number AT80574KJ073N AT80574JJ053N AT80574JH046NT AT80573QJ0806M AT80573QJ0536M AT80573JJ0676MT

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AT80573QJ0806M	AT80573QJ0806M (pdf)

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AT80573QJ0536M	AT80573QJ0536M

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45nm Processors Embedded Computing 45nm Processors 5400/5200 Series for Embedded Computing Platforms Boost performance and energy efficiency for full-performance and bladed platforms Product Overview These processors, with extended lifecycle support, utilize Intel’s Hafnium-based 45nm Hi-k silicon process technology to reduce power consumption, increase switching speed, and significantly increase transistor density over previous 65nm technology to 820 million transistors. The processor delivers a 27% performance gain1 within the same thermal profile over the previous-generation Intel Xeon processor see Figure 1 , making it an excellent choice for computeintensive embedded, storage and communications applications. Lower thermal design power TDP and higher Tcase temperature options are ideal for low-power consumption and/or compliance with the AdvancedTCA* form factor and NEBS level-3 thermal specifications. The quad-core 5400 series supports 12 MB ondie L2 cache 2x6 MB and the dual-core 5200 series supports 6 MB on-die L2 cache. All processors integrate Virtualization Technology2 VT , 64 architecture,3 VT FlexMigration, and VT FlexPriority. These quad- and dual-core processors utilize a common microarchitecture and common socket with the previousgeneration Intel Xeon processor 5300 series and 5100 series, providing a simplified path to upgrades. 27% Performance SPECint_base2000 Increase1 29381 SPECint_base2000 19882 SPECfp_base2000 19288 SPECfp_base2000 Processor GHz 65nm Processor GHz 45nm Figure 1 Performance improvements of the 45nm processor in dual-processing configuration eight cores per system . Platform Configurations These 45nm processors are validated with two different chipsets, providing a choice of flexible, dual-processor-capable platforms for a wide range of applications. These include storage area networks, network attached storage, routers, IP-PBX, converged/unified communications platforms, sophisticated content firewalls, unified threat management systems, medical imaging equipment, military signal and image processing, and telecommunications wireless and wireline servers. • 5000P chipset-based platforms are ideal for full performance and memory-intense applications by providing a maximum FB-DIMM memory capacity of 64 GB, 28 lanes of PCI Express, and accelerated I/O options. This platform offers quick migration for customers with existing Intel 5000P chipset-based designs due to the LGA 771 socket, common with the quad-core 5300 series and dual-core 5100 series, eliminating software tuning and minimizing hardware qualification efforts see Figure • 5100 Memory Controller Hub MCH chipset-based platforms are ideal for bladed and dense bladed applications requiring less than 200 watts, including AdvancedTCA and NEBS-compliant solutions. Platform power savings is derived from lower TDP in the MCH watts TDP at 1333 MHz front-side bus [FSB] and watts TDP at 1066 MHz FSB , the efficient next-generation I/O Controller Hub 9R at 4.3W TDP, and standard native DDR2 memory technology with a maximum capacity of 48 GB see Figure Processor 5400 or 5200 Series Processor 5400 or 5200 Series 6321ESB I/O Controller Up to 2x 1333 MHz 5000P Memory Controller Hub PCI Express* with 28 lanes DDR2 FB-DIMM DDR2 FB-DIMM DDR2 FB-DIMM DDR2 FB-DIMM up to 64 GB max memory Figure 2 5000P chipset-based platforms Processor 5400 or 5200 Series Processor 5400 or 5200 Series I/O Controller Hub 9R 6 PCI Express* lanes as 1 x4 or 6 x1 wide links Up to 2x 1333 MHz 5100 Memory

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45nm Processors Embedded Computing
45nm Processors 5400/5200 Series for Embedded Computing Platforms

Boost performance and energy efficiency for full-performance and bladed platforms

Product Overview

These processors, with extended lifecycle support, utilize Intel’s Hafnium-based 45nm Hi-k silicon process technology to reduce power consumption, increase switching speed, and significantly increase transistor density over previous 65nm technology to 820 million transistors. The processor delivers a 27% performance gain1 within the same thermal profile over the previous-generation Intel Xeon processor see Figure 1 , making it an excellent choice for computeintensive embedded, storage and communications applications.

Lower thermal design power TDP and higher Tcase temperature options are ideal for low-power consumption and/or compliance with the AdvancedTCA* form factor and NEBS level-3 thermal specifications. The quad-core 5400 series supports 12 MB ondie L2 cache 2x6 MB and the dual-core 5200 series supports 6 MB on-die L2 cache. All processors integrate Virtualization Technology2 VT , 64 architecture,3 VT FlexMigration, and VT FlexPriority.

These quad- and dual-core processors utilize a common microarchitecture and common socket with the previousgeneration Intel Xeon processor 5300 series and 5100 series, providing a simplified path to upgrades.
27% Performance

SPECint_base2000

Increase1
29381

SPECint_base2000
19882

SPECfp_base2000
19288 SPECfp_base2000

Processor GHz 65nm

Processor GHz 45nm

Figure 1 Performance improvements of the 45nm processor in dual-processing configuration eight cores per system .

Platform Configurations

These 45nm processors are validated with two different chipsets, providing a choice of flexible, dual-processor-capable platforms for a wide range of applications. These include storage area networks, network attached storage, routers, IP-PBX, converged/unified communications platforms, sophisticated content firewalls, unified threat management systems, medical imaging equipment, military signal and image processing, and telecommunications wireless and wireline servers.
• 5000P chipset-based platforms are ideal for full performance and memory-intense applications by providing a maximum FB-DIMM memory capacity of 64 GB, 28 lanes of PCI Express*, and accelerated I/O options. This platform offers quick migration for customers with existing Intel 5000P chipset-based designs due to the LGA 771 socket, common with the quad-core 5300 series and dual-core 5100 series, eliminating software tuning and minimizing hardware qualification efforts see Figure
• 5100 Memory Controller Hub MCH chipset-based platforms are ideal for bladed and dense bladed applications requiring less than 200 watts, including AdvancedTCA* and NEBS-compliant solutions. Platform power savings is derived from lower TDP in the MCH watts TDP at 1333 MHz front-side bus [FSB] and watts TDP at 1066 MHz FSB , the efficient next-generation I/O Controller Hub 9R at 4.3W TDP, and standard native DDR2 memory technology with a maximum capacity of 48 GB see Figure

Processor 5400 or 5200 Series

Processor 5400 or 5200 Series
6321ESB

I/O Controller

Up to 2x 1333 MHz
5000P Memory

Controller Hub

PCI Express* with 28 lanes

DDR2 FB-DIMM DDR2 FB-DIMM DDR2 FB-DIMM DDR2 FB-DIMM
up to 64 GB max memory

Figure 2 5000P chipset-based platforms

Processor 5400 or 5200 Series

Processor 5400 or 5200 Series

I/O Controller

Hub 9R
6 PCI Express* lanes as 1 x4
or 6 x1 wide links

Up to 2x 1333 MHz
5100 Memory

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Datasheet ID: AT80573QJ0806M 638956