2283B
2283B Datasheet
z Bond-on heat sinks for leadless chip carriers and flat packs. z Primarily designed for 68-position devices. z The 2283 is ideally suited to limited board space applications with high air flow.
| Part | Datasheet |
|---|---|
2283B |
2283B (pdf) |
| Related Parts | Information |
|---|---|
2286B |
2286B |
| PDF Datasheet Preview |
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| Heat Sinks by Product - radial fin Search by part # Check distributor part inventory Browse Heat sinks - By Device - - By Product Line - 6 -Attachment Methods6 - Interface Materials -6 - Accessories - ---Useful Links--- 6 Products / BGA / Radial Fins Radial Fin Heat Sinks for Microprocessors z Bond-on heat sinks for leadless chip carriers and flat packs. z Primarily designed for 68-position devices. z The 2283 is ideally suited to limited board space applications with high air flow. Part Number 2283BG Useful Links • Building a part # • Catalog Request • Directions • Find Distributor • Find Sales Associate • How to order? • MSDS Safety Sheets • Part # Cross Ref • Quote Request • RoHS Initiative • Sample Request Part Number 2286BG< 4/19/2010 Heat Sinks by Product - radial fin Part Number 2288BG Part Number 2292BG Part Number 2296BG 4/19/2010 Heat Sinks by Product - radial fin 4/19/2010 |
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